| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film processing method ensuring more excellent processing accuracy and processing quality with lower energy. <P>SOLUTION: The film processing method forming a removal part by irradiating a removed part of a film, formed on the first principal surface of a glass substrate having a first principal surface and a second principal surface facing the first principal surface, with a laser beam includes a first step for removing the side surface at the removed part by irradiation of a picosecond laser beam or a femtosecond laser beam, and a second step for forming the removal part by removing the removed part from where the side surface is removed in the first step by irradiation of a nanosecond laser beam. <P>COPYRIGHT: (C)2013,JPO&INPIT |
