| 摘要 |
The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) placing an electronic component for encapsulating into a mould cavity connecting to the carrier, B) filling the mould cavity with liquid encapsulating material, and C) at least partially curing the encapsulating material in the mould cavity A reduction material is introduced during processing step B). Said material undergoes a phase change during processing step B) whereby the volume of the reduction material decreases. The invention also relates to a device for applying this method.
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