发明名称 |
BUFFER FILM FOR MULTI-CHIP PACKAGING |
摘要 |
A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.
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申请公布号 |
US2013092310(A1) |
申请公布日期 |
2013.04.18 |
申请号 |
US201113805553 |
申请日期 |
2011.09.12 |
申请人 |
ISHIGAMI AKIRA;KANISAWA SHIYUKI;NAMIKI HIDETSUGU;UMAKOSHI HIDEAKI;AOKI MASAHARU;DEXERIALS CORPORATION |
发明人 |
ISHIGAMI AKIRA;KANISAWA SHIYUKI;NAMIKI HIDETSUGU;UMAKOSHI HIDEAKI;AOKI MASAHARU |
分类号 |
H01L33/48;H01L33/00 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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