发明名称 ADHESIVE COMPOSITION FOR MEDICAL APPARATUS AND ENDOSCOPIC DEVICE
摘要 <p>This adhesive composition for a medical apparatus contains: a main agent composed of one or more species of epoxy resin selected from the group consisting of a bisphenol A-type epoxy resin, a bisphenol F-type epoxy resin, and a phenol novolak-type epoxy resin; a curing agent including metaxylylenediamine and/or a derivative thereof; acrylic rubber; and a filler; wherein the filler is alumina.</p>
申请公布号 WO2013051458(A1) 申请公布日期 2013.04.11
申请号 WO2012JP74895 申请日期 2012.09.27
申请人 OLYMPUS CORPORATION 发明人 KOBAYASHI KOJI;NIINO RIEKO;NAKAMURA MITSUHIRO;MATSUMOTO JUN
分类号 C09J163/00;A61B1/00;C09J11/04;C09J11/06;C09J133/04;C09J163/02;C09J163/04;G02B23/24 主分类号 C09J163/00
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