发明名称 CUTTING APPARATUS AND CUTTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a workpiece cutting apparatus that manufactures a high-precision multilayer ceramic capacitor at low cost. <P>SOLUTION: The cutting apparatus 100 for cutting a workpiece 10 to manufacture the multilayer ceramic capacitor includes: a blade 22 for cutting the workpiece 10; a spindle 20 including a motor for rotating the blade 22; an imaging device 30 configured to switch an illumination between a ring illumination and a coaxial episcopic illumination to image the workpiece 10; and a control unit 40 that processes an image of the workpiece 10 obtained by the imaging device 30 to identify a cutting position of the workpiece 10 and controls the blade 22 to cut the identified position of the workpiece 10. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013063490(A) 申请公布日期 2013.04.11
申请号 JP20110203846 申请日期 2011.09.16
申请人 APIC YAMADA CORP 发明人
分类号 B24B27/06;B24B49/12 主分类号 B24B27/06
代理机构 代理人
主权项
地址