发明名称 SEMICONDUCTOR LIGHT-EMITTING ELEMENT, WAFER, METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD OF MANUFACTURING WAFER
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element having high efficiency, a wafer, a method of manufacturing the semiconductor light-emitting element, and a method of manufacturing the wafer. <P>SOLUTION: The semiconductor light-emitting element includes an n-type first layer, a p-type second layer, a light-emitting part provided between the first layer and the second layer, a first stacked structure provided between the first layer and the light-emitting part, and a second stacked structure provided between the first layer and the first stacked structure. The light-emitting part includes a plurality of barrier layers and well layers provided between the plurality of barrier layers. The first stacked structure includes a plurality of third layers that contain a nitride semiconductor, and a plurality of fourth layers that are alternately stacked with the plurality of third layers and contain GaInN having a thickness thinner than that of the well layers. The second stacked structure includes a plurality of fifth layers that contain a nitride semiconductor having a different composition from that of the third layers, and a plurality of sixth layers that are alternately stacked with the plurality of fifth layers and contain GaInN having a thickness thinner than that of the well layers. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013065630(A) 申请公布日期 2013.04.11
申请号 JP20110202319 申请日期 2011.09.15
申请人 TOSHIBA CORP 发明人 KUSHIBE MITSUHIRO;OBA YASUO;KATSUNO HIROSHI;KANEKO KATSURA;YAMADA SHINJI
分类号 H01L33/32;H01S5/343 主分类号 H01L33/32
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