| 摘要 |
A method and device for transferring a chip ( 18 ) situated on a transfer substrate ( 26 ) to a contact substrate ( 50 ), and for contacting the chip with the contact substrate, in which the chip, the back side ( 19 ) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts ( 59, 60 ) thereof that are arranged opposite a contact surface ( 58 ) of the contact substrate are brought into contact with substrate contacts ( 56, 57 ) arranged on the contact surface by means of a pressing device ( 45, 46 ) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts. |
