| 发明名称 |
MEMS SENSOR |
| 摘要 |
<p>The present invention has a signal-processing LSI in which is installed a temperature sensor for measuring the sensor temperature, and a MEMS sensor chip installed on the signal-processing LSI; the MEMS sensor chip being installed on the heat-generating unit of the signal-processing LSI. It is thereby possible to provide a MEMS sensor in which the effect of the change in temperature characteristics due to heat is reduced.</p> |
| 申请公布号 |
WO2013046955(A1) |
申请公布日期 |
2013.04.04 |
| 申请号 |
WO2012JP70420 |
申请日期 |
2012.08.10 |
| 申请人 |
HITACHI AUTOMOTIVE SYSTEMS, LTD.;OHSAKA ICHIRO;OHTA KAZUNORI |
发明人 |
OHSAKA ICHIRO;OHTA KAZUNORI |
| 分类号 |
G01P15/08;G01C19/5783;G01P1/02;G01P21/00 |
主分类号 |
G01P15/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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