| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for fragile member processing that is suitably used for a processing method of a fragile member which stably holds the fragile member when the fragile member, such as a semiconductor wafer, is transported and processing, such as a rear surface grinding, is performed and enables the fragile member to be peeled without causing the damage after the required processing is finished. <P>SOLUTION: An adhesive sheet for fragile member processing according to the invention is composed of: a lamination film base material which has a first film and a second film and is formed by fastening peripheral parts of the first and second films and placing the two films in contact with each other in an airtight manner to be integrated at an internal region enclosed by fastening parts; and an adhesive layer formed on both outer surfaces of the lamination film base material. <P>COPYRIGHT: (C)2013,JPO&INPIT |
