SEGMENTABLE WIRING BOARD AND METHOD FOR PRODUCING THE SAME, AND WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

摘要

A segmentable wiring board includes a ceramic base body, a conductor, a metal plating film and a glass layer, the glass layer having an upwardly-protruding convexity located on the metal plating film. The ceramic base body has a plurality of wiring substrate regions and dividing grooves located in boundaries among the plurality of wiring substrate regions. Moreover, the conductor is located in a periphery of each of the plurality of wiring substrate regions. Moreover, the metal plating film is located on the conductor. Further, the glass layer coveringly extends from an inner surface of each of the dividing grooves of the ceramic base body to the metal plating film.