发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, RIB PATTERN FORMATION METHOD, HOLLOW STRUCTURE AND FORMATION METHOD FOR SAME, AND ELECTRONIC COMPONENT |
摘要 |
Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition. Used as the component (A) are acrylate compounds or methacrylate compounds, to be specific, an acrylate compound or a methacrylate compound having an amide group and an acrylate compound or a methacrylate compound containing a urethane bond. |
申请公布号 |
US2013076458(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
US201113698374 |
申请日期 |
2011.05.19 |
申请人 |
KATOU SADAAKI;KAMEI JUNICHI |
发明人 |
KATOU SADAAKI;KAMEI JUNICHI |
分类号 |
G03F7/031;B32B1/06;G03F7/028;G03F7/20;H03H9/64 |
主分类号 |
G03F7/031 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|