发明名称 |
STACKED-CHIP IMAGING SYSTEMS |
摘要 |
Imaging systems may be provided with stacked-chip image sensors. A stacked-chip image sensor may include a vertical chip stack that includes an array of image pixels, analog control circuitry and storage and processing circuitry. The array of image pixels, the analog control circuitry, and the storage and processing circuitry may be formed on separate, stacked semiconductor substrates or may be formed in a vertical stack on a common semiconductor substrate. The image pixel array may be coupled to the control circuitry using vertical metal interconnects. The control circuitry may route pixel control signals and readout image data signals over the vertical metal interconnects. The control circuitry may provide digital image data to the storage and processing circuitry over additional vertical conductive interconnects coupled between the control circuitry and the storage and processing circuitry. The storage and processing circuitry may be configured to store and/or process the digital image data. |
申请公布号 |
WO2013041924(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
WO2012IB01018 |
申请日期 |
2012.04.27 |
申请人 |
APTINA IMAGING CORPORATION;SOLHUSVIK, JOHANNES;BALES, TIM |
发明人 |
SOLHUSVIK, JOHANNES;BALES, TIM |
分类号 |
G06T5/00;H01L27/146;H04N5/345 |
主分类号 |
G06T5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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