HIGH FREQUENCY INDUCTION HEATING APPARATUS AND EUTECTIC DIE BONDING SYSTEM USING THEREOF

摘要

PURPOSE: A high frequency induction heating apparatus and a eutectic die bonding system using thereof are provided to prevent damage to parts due to heat. CONSTITUTION: An encapsulated type chamber(300) includes a substrate. Opening grooves are formed in a bracket layer(141,142). A high frequency induction heating apparatus receives the high frequency signal from a high frequency oscillator. The high frequency induction heating apparatus generates eddy current in the opening grooves. The substrate includes a eutectic layer(130).