POWER SEMICONDUCTOR MODULE

摘要

PURPOSE: A power semiconductor module is provided to improve heat dissipation by using a wide metal ribbon instead of a wire. CONSTITUTION: A first semiconductor chip(130) is mounted on a circuit board and includes a gate, an emitter terminal, and a collector terminal. A second semiconductor chip(140) is formed on the first semiconductor chip and includes a collector terminal, a cathode terminal, and an anode terminal. A first conductivity connection member(150a) is arranged between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip. A second conductivity connection member(150b) is connected to the anode terminal of the second semiconductor chip and the emitter pattern of the circuit board.