LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A light emitting diode package is provided to improve heat dissipation by using a heat sink having partial ends. CONSTITUTION: A package body(11) supports a heat sink(12). The lower part of the heat sink is exposed to the outside of the package body. A light emitting device(13) is mounted on the heat sink. A lead frame(14) is electrically connected to the light emitting device. The end of the heat sink is bent to be exposed to the outside of the package body.