| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device which is made small-sized, and to make a connection part not come off against strong vibration even after the semiconductor device is completed. SOLUTION: This device is equipped with a base 1 which has a recess 1a formed in its upper main surface and also has an electrode pad 4 formed on the top surface of the side wall 1c of the recess 1a, a semiconductor element 2 which is mounted on the bottom surface 1b of the recess 1a and provided with a light reception part 2a at the center of the top surface and also has an electrode 3 formed at the peripheral edge, a bonding wire 5 which electrically connects the electrode 3 and electrode pad 4 together, a resin layer 6 which is provided to the entire periphery of the top surface of the side wall while covering the electrode pad 4, and a translucent lid 7 which is adhered with the upper part of the resin layer 6 to seal the semiconductor element 2. |
