| 发明名称 |
Verfahren zur Oberflaechenbehandlung von Kupfer und Kupferlegierungen |
| 摘要 |
<p>Passing a current through the surface of copper and its alloys as a cathode while the surface is in contact with a solution containing chromate ions results in improved adhesion subsequently formed between the metal and organic materials.</p> |
| 申请公布号 |
DE1912542(A1) |
申请公布日期 |
1969.10.30 |
| 申请号 |
DE19691912542 |
申请日期 |
1969.03.12 |
| 申请人 |
WESTERN ELECTRIC COMPANY INC. |
发明人 |
NIHCHALDAS VAZIRANI,HARGOVIND |
| 分类号 |
C09J5/00;C09J5/02;C25D11/38 |
主分类号 |
C09J5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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