| 摘要 |
The invention discloses a structure of heat dissipation substrate of power LED and a device made thereof. The invention overcomes drawbacks such as complex structure of power LED, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of heat dissipation substrate of the invention comprises: an one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other, and the through hole is smaller than the blind hole, and both of them share the same direction of axis; the heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit; a plurality of counterbores may be arranged on the circuit board; the circuit board may also comprise a plurality of position lines for cutting and a plurality of slots and/or holes. The power LED device manufactured by using the heat dissipation substrate comprises: a heat sink, a circuit board with a counterbore, a LED chip, bonding wires, and encapsulation colloid. The encapsulation colloid covers the side of the circuit board carrying the chip and lead lines, and an external electrode part is kept outside. The encapsulation colloid functions not only as a sealing layer for sealing the chip and the bonding wire, but also as an optical lens integrated with the device. |
