METHOD OF MANUFACTURING SUBSTRATE

摘要

PURPOSE: A method for manufacturing a substrate is provided to improve the flatness of a wafer and prevent spots or scratches by applying a wet etching process. CONSTITUTION: An ingot is sliced into a substrate(S110). Both sides of the substrate are lapped(S120). The substrate with lapped sides is wet-etched with etchant(S130). The rear of the wet-etched substrate is sandblasted(S140). The sandblasted substrate is wet-etched with the etchant(S150). The edges of the wet-etched substrate are processed(S160). The front of the substrate with the processed edges is polished(S170). [Reference numerals] (AA) Start; (BB) End; (S110) Slicing; (S120) Lapping both sides; (S130,S150) Etching; (S140) Sandblasting(-surface sandblasting); (S160) Processing an edge; (S170) Polishing a pad section