发明名称 |
LIGHT EMITTING DIODE (LED) PACKAGE HAVING WAVELENGTH CONVERSION MEMBER AND WAFER LEVEL FABRICATION METHOD |
摘要 |
A light emitting diode (LED) package includes a substrate and a light emitting diode (LED) die on the substrate configured to emit electromagnetic radiation in a first spectral region. The (LED) package also includes a dielectric layer on the (LED) die and a wavelength conversion member on the dielectric layer configured to convert the electromagnetic radiation in the first spectral region to electromagnetic radiation in a second spectral region. The (LED) package also includes an interconnect comprising a conductive trace on the wavelength conversion member and on the dielectric layer in electrical contact with a die contact on the (LED) die and with a conductor on the substrate, and a transparent dome configured as a lens encapsulating the (LED) die.
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申请公布号 |
US2013062640(A1) |
申请公布日期 |
2013.03.14 |
申请号 |
US201113229836 |
申请日期 |
2011.09.12 |
申请人 |
YEN JUI- KANG;DOAN TRUNG TRI;SEMILEDS OPTOELECTRONICS CO., LTD. |
发明人 |
YEN JUI- KANG;DOAN TRUNG TRI |
分类号 |
H01L33/50;H01L33/62 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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