发明名称 |
Semiconductor apparatus with thin semiconductor film |
摘要 |
A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.
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申请公布号 |
US8395159(B2) |
申请公布日期 |
2013.03.12 |
申请号 |
US20090591475 |
申请日期 |
2009.11.20 |
申请人 |
OGIHARA MITSUHIKO;FUJIWARA HIROYUKI;SAKUTA MASAAKI;ABIKO ICHIMATSU;OKI DATA CORPORATION |
发明人 |
OGIHARA MITSUHIKO;FUJIWARA HIROYUKI;SAKUTA MASAAKI;ABIKO ICHIMATSU |
分类号 |
H01L29/04;B41J2/44;B41J2/45;B41J2/455;G03G15/04;H01L27/15;H01L29/22;H01L33/08;H01L33/44;H04N1/036 |
主分类号 |
H01L29/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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