THREE-DIMENSIONAL NETWORK ON CHIP AND COMMUNICATION METHOD OF THE SAME

摘要

PURPOSE: A network on chip of a three dimensional structure and a communicating method thereof are provided to improve communication efficiency by vertically transmitting a packet through not only a TSV(Through Silicon Via) but also an inactive posterior parallel router. CONSTITUTION: A plurality of IP blocks(101-116) are connected and transmit and receive a packet. A parallel router(411) corresponds to a group classifying the plurality of IP blocks to include two or more adjacent IP blocks. A parallel transmission and reception control unit(510) collects each state of the parallel router and generates the state information. The parallel transmission and reception control unit provides the state information according to one request from the plurality of IP blocks. A TSV(410,420,430,440) passes through two or more layers to be commonly connected to the parallel router of each layer by corresponding to one group.