RADAR PACKAGE FOR MILLIMETER WAVE

摘要

PURPOSE: A radar package for millimeter wave is provided to secure miniaturization and integration by using a TSV(Through Silicon Via). CONSTITUTION: A patch antenna(10) includes a silicon substrate(11) and a patch type array antenna(12). A transceiver chip(20) includes a transceiver module. A feeding network(50) is formed between the transceiver chip and the patch antenna. A solder ball(80) for flip chip bonding is formed in the lower part of the transceiver chip. A TSV(60) electrically connects chips.