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发明名称
POLISHING COMPOSITION AND POLISHING METHOD FOR FORMING COPPER WIRING FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要
申请公布号
EP1965417(B1)
申请公布日期
2013.03.06
申请号
EP20060835087
申请日期
2006.12.21
申请人
ASAHI GLASS COMPANY, LIMITED
发明人
YOSHIDA, IORI;KAMIYA, HIROYUKI;TAKEMIYA, SATOSHI;HAYASHI, ATSUSHI;NAKAZAWA, NORIHITO
分类号
H01L21/321;B24B37/00;C09G1/02;C09K3/14;H01L21/304
主分类号
H01L21/321
代理机构
代理人
主权项
地址
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