| 摘要 |
An electronic component incorporating board that is less susceptible to a solder flash phenomenon therein even with application of heat, for example, when it is mounted to another substrate, includes a core substrate, electrodes located respectively on one principal surface and the other principal surface of the core substrate, an electronic component mounted to the electrodes that are located on the one principal surface of the core substrate, and a resin layer located on the one principal surface of the core substrate and covering the electronic component, wherein surfaces of the electrodes located on the one principal surface of the core substrate are not plated. |
