发明名称 |
LEAD FRAME HAVING A FLAG WITH IN-PLANE AND OUT-OF-PLANE MOLD LOCKING FEATURES |
摘要 |
A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes. |
申请公布号 |
US2013049181(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201113220898 |
申请日期 |
2011.08.30 |
申请人 |
WEN JIAN;FREAR DARREL R.;MCDONALD WILLIAM G. |
发明人 |
WEN JIAN;FREAR DARREL R.;MCDONALD WILLIAM G. |
分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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