Heat transfer in an electronic device

摘要

Heat transfer in an electronic device by means of a heat transfer element (2) and the method of preparing such a device. The electronic device comprises at least one heat dissipating component (1) and the heat transfer element (2) has a connection area (3) connected to said at least one heat dissipating component (1). The heat transfer element (2) also has at least one heat dissipating area (4) and including a thermal path from the connection area (3) to the at least one heat dissipating area (4). The heat transfer element (2) further includes carbon fibers (5) arranged along the thermal path. According to an embodiment, the carbon fibers (5) are pitch based carbon fibers and are embedded in a resin. Then, the heat transfer element (2) can provide greater thermal conductivity in the direction (6) along the thermal path compared to the direction perpendicular to the thermal path.