发明名称 Semiconductor device having trench gate VDMOSFET and method of manufacturing the same
摘要 A semiconductor device includes a first conductivity type layer of a first conductivity type, a body layer of a second conductivity type formed on the first conductivity type layer, a gate trench passing through the body layer so that the deepest portion thereof reaches the first conductivity type layer, a source region of the first conductivity type formed around the gate trench on the surface layer portion of the body layer, a gate insulating film formed on the bottom surface and the side surface of the gate trench, and a gate electrode embedded in the gate trench through the gate insulating film, and the bottom surface of the gate electrode and the upper surface of the first conductivity type layer are flush with each other.
申请公布号 US8384152(B2) 申请公布日期 2013.02.26
申请号 US20080232582 申请日期 2008.09.19
申请人 ROHM CO., LTD.;NAKAGAWA YOSHIKAZU;IZUMI NAOKI;NAGATA MASAKI 发明人 NAKAGAWA YOSHIKAZU;IZUMI NAOKI;NAGATA MASAKI
分类号 H01L29/66 主分类号 H01L29/66
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