| 摘要 |
PURPOSE: A substrate processing apparatus having a structure of blocking access to an upper electrode is provided to use various plasma forming modes since the RF power is provided through the contact with and separation from an upper electrode. CONSTITUTION: A top matching module(65) is located on the top of a chamber(50). A matching cover(66) is carried by an top module drive device(69) to the top and bottom. A matching box(67) is installed inside the matching cover. A connection electrode(68A) is touched with a power connection unit(61) of an upper electrode(60). The matching box and the connection electrode are consecutively connected to a first power feeder and a RF power supply line(68). The connection electrode is projected to a lower portion of the matching cover. |
