| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition showing excellence in all of low thermal expansion, adhesion to copper foils, heat resistance, flame retardancy, heat resistance (T-300) with copper, a dielectric property and drilling workability, and to provide a prepreg, a laminate and a wiring board each using the same. <P>SOLUTION: In a method for producing a compatibilizing resin, a cyanate compound is reacted with a siloxane resin having a hydroxy group at its terminal and an epoxy resin at a specific reaction rate. The thermosetting resin composition contains a compatibilizing resin (A) produced by the method and fused silica (B) whose surface is treated with a trimethoxysilane compound. The prepreg, laminate and wiring board are made by using the same. <P>COPYRIGHT: (C)2013,JPO&INPIT |
