Wafer level image sensor packaging structure and manufacturing method of the same

摘要

The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product (30), a plurality of solder balls (B), and an encapsulant (40). The semi-finished product (30) includes an image sensing chip (11) and a wafer level lens assembly (21). The encapsulant (40) is disposed on lateral sides of the image sensing chip (11) and the wafer level lens assembly (21). Also, the manufacturing method includes the steps of: providing a silicon wafer (S11), dicing the silicon wafer (S12), providing a lens assembly wafer (S13), fabricating a plurality of semi-finished products (S14), performing a packaging process (S15), mounting the solder balls (S16), and cutting the encapsulant (S17). Accordingly, the encapsulant (40) encapsulates each of the semi-finished products (30) by being disposed on the lateral sides thereof.