| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface inspection device enabling appropriate inspection of an outer edge part of a plate-like member such as semiconductor wafer, etc. <P>SOLUTION: A semiconductor wafer inspection device 10 comprises: an imaging lens 22 that is arranged opposite to an outer edge part 101 of a semiconductor wafer 100; an imaging surface 24 that is arranged opposite to an outer end surface of the semiconductor wafer 100 through the imaging lens 22; a mirror 12 for causing an image on a first outer bevel surface 101b of the semiconductor wafer 100 to be formed on the imaging surface 24 through the imaging lens 22; a mirror 14 for causing an image on a second outer bevel surface 101c of the semiconductor wafer 100 to be formed on the imaging surface 24 through the imaging lens 22; a correction lens 26 for causing an image on an outer end surface 101a of the semiconductor wafer 100 to be formed on the imaging surface 24 through a central part of the imaging lens 22; and an illumination light guide lamplight part 18 for illuminating the first outer bevel surface 101b and the second outer bevel surface 101c so that they become brighter than the outer end surface 101a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
