| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a light emitting element mounting substrate which allows for flip chip mounting using a single-sided wiring board, and has excellent heat dissipation and light reflectivity, and facilitates dividing an LED package into individual pieces; and the LED package using the light emitting element mounting substrate. <P>SOLUTION: A light emitting element mounting substrate 2 includes: a pair of wiring patterns 22A and 22B, each of which has a mounting region 30 configured to mount an LED chip 3 thereon, and is formed on a surface 20a of a resin film 20; a pair of filling parts 23A and 23B contacted with the pair of wiring patterns 22A and 22B, respectively; and an insulating layer 24 having light reflectivity which is formed on the surface 10a of the resin film 20 so as to cover the pair of wiring patterns 22A and 22B. The pair of filling parts 23A and 23B respectively have protruding parts 230 and 231 that protrude outward from the pair of wiring patterns 22A and 22B. The insulating layer 24 includes an opening 24a for passing bumps 32a and 32b electrically connected to the LED chip 3, in a region corresponding to the mounting region 30. <P>COPYRIGHT: (C)2013,JPO&INPIT |
