发明名称 THIN SOLID ELECTROLYTIC CAPACITOR EMBEDDABLE IN A SUBSTRATE
摘要 <p>An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.</p>
申请公布号 EP2130208(B1) 申请公布日期 2013.02.13
申请号 EP20080730662 申请日期 2008.02.25
申请人 KEMET ELECTRONICS CORPORATION 发明人 PRYMAK, JOHN, D.;STOLARSKI, CHRIS;JACOBS, DAVID;WAYNE, CHRIS;LESSNER, PHILIP;KINARD, JOHN, T.;MELODY, ALETHIA;DUNN, GREGORY;CROSWELL, ROBERT, T.;CHELINI, REMY, J.
分类号 H01G9/055;H01G9/012;H01G9/15 主分类号 H01G9/055
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