发明名称 |
Lighting emitting diode (LED) package and method of fabrication |
摘要 |
<p>A light emitting diode (LED) package includes a substrate, a light emitting diode (LED) die mounted to the substrate, a frame on the substrate, a wire bonded to the light emitting diode (LED) die and to the substrate, and a transparent dome configured as a lens encapsulating the light emitting diode (LED) die. A method for fabricating a light emitting diode (LED) package includes the steps of: providing a substrate; forming a frame on the substrate; attaching a light emitting diode (LED) die to the substrate; wire bonding a wire to the light emitting diode (LED) die and to the substrate; and dispensing a transparent encapsulation material on the frame configured to form a transparent dome and lens for encapsulating the light emitting diode (LED) die.</p> |
申请公布号 |
EP2445021(A3) |
申请公布日期 |
2013.02.13 |
申请号 |
EP20110185772 |
申请日期 |
2011.10.19 |
申请人 |
SEMILEDS OPTOELECTRONICS CO., LTD. |
发明人 |
LIU, WEN-HUANG;DAN, CHUNG-CHE;CHANG, YUAN-HSIAO;KAO, HUNG-JEN;CHU, CHEN-FU;CHENG, HAO-CHUN |
分类号 |
H01L33/54;H01L25/075;H01L33/56 |
主分类号 |
H01L33/54 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|