| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing an effect of noise. <P>SOLUTION: A mold resin 50 contains a region which is constituted by mixing a resin 50a with a magnetic material 50b. The mold resin 50 which is arranged between adjoining leads 30 is constituted by mixing the resin 50a with a dielectric material 50c. With this configuration, the inductance or capacitance of a semiconductor device can be increased, for a lower resonance frequency. As a result, the frequency of a noise which is amplified can be lowered, and even if the noise is amplified, the effect on a semiconductor chip 20 can be suppressed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
