METHOD FOR MANUFACTURING A BUMP BY EMPLOYING A MICRO-BALL SYSTEM

摘要

PURPOSE: A method for manufacturing a bump is provided to prevent the fault of a product by vibrating a substrate in all directions. CONSTITUTION: Solder resist(100) is coated on the surface of a substrate. A copper circuit including a copper foil pad is formed on the surface of the substrate. A solder resist opening part is formed by selectively etching the solder resist. Flux(140) coated on the upper side of the solder resist is removed. A microball(160) is received in the solder resist opening part.