| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of dividing an optical device substrate capable of cutting the optical device substrate into individual optical devices without performing position correction when executing a laser processing groove formation step. <P>SOLUTION: A method of dividing an optical device substrate includes the steps of: radiating a laser beam along first and second division scheduled lines 301, 302 passing though the center of the optical device substrate stuck on a surface of a dicing tape T to divide the substrate into at least four block substrates 30a-30d; forming a laser processing groove 303 by radiating the laser beam along a plurality of first division scheduled lines 231 formed on each block substrate; and forming a laser processing groove 304 by radiating the laser beam along a plurality of second division scheduled lines 232. The first groove formation step and the second groove formation step are alternately executed and each block substrate is cut along all of the first and second division scheduled lines and divided into the individual optical devices. <P>COPYRIGHT: (C)2013,JPO&INPIT |
