PURPOSE: A light emitting diode package is provided to prevent a disconnection of a bonding wire or the crack and separation of a lens unit. CONSTITUTION: A light emitting diode chip(110) is electrically connected to a first lead frame(120a) and a second lead frame(120b). A lens unit(140) is made of transparent resins to cover the light emitting diode chip. The lens unit includes a flat plate(140a) and a convex part(140b). The flat plate and the convex part change the distribution of light emitted from the light emitting diode chip. A concave groove part(140c) is formed on the upper side of the convex part of the lens unit. A wavelength converting unit(130) converts light emitted from the light emitting diode chip to a specific wavelength.
申请公布号
KR20130010667(A)
申请公布日期
2013.01.29
申请号
KR20110071441
申请日期
2011.07.19
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
HAN, TAE HEON;PARK, JUNG KYU;KIM, JIN MO;HONG, MAN KI;SHIN, CHURL WUNG