发明名称 Thick nitride semiconductor structures with interlayer structures
摘要 A semiconductor structure includes a substrate, a nucleation layer on the substrate, a compositionally graded layer on the nucleation layer, and a layer of a nitride semiconductor material on the compositionally graded layer. The layer of nitride semiconductor material includes a plurality of substantially relaxed nitride interlayers spaced apart within the layer of nitride semiconductor material. The substantially relaxed nitride interlayers include aluminum and gallium and are conductively doped with an n-type dopant, and the layer of nitride semiconductor material including the plurality of nitride interlayers has a total thickness of at least about 2.0 μm.
申请公布号 US8362503(B2) 申请公布日期 2013.01.29
申请号 US20070716319 申请日期 2007.03.09
申请人 CREE, INC.;SAXLER ADAM WILLIAM;BURK, JR. ALBERT AUGUSTUS 发明人 SAXLER ADAM WILLIAM;BURK, JR. ALBERT AUGUSTUS
分类号 H01L27/14 主分类号 H01L27/14
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