| 发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED THEREIN, AND SEMICONDUCTOR DEVICE OBTAINED THEREBY |
| 摘要 |
The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175-C is 2000 Pa or more.
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| 申请公布号 |
US2013020724(A1) |
申请公布日期 |
2013.01.24 |
| 申请号 |
US201213615221 |
申请日期 |
2012.09.13 |
| 申请人 |
MISUMI SADAHITO;MATSUMURA TAKESHI;HOSOKAWA KAZUHITO;KONDO HIROYUKI |
发明人 |
MISUMI SADAHITO;MATSUMURA TAKESHI;HOSOKAWA KAZUHITO;KONDO HIROYUKI |
| 分类号 |
C09J163/00;C09J133/00;H01L21/56;H01L23/28 |
主分类号 |
C09J163/00 |
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