发明名称 DIE BONDER
摘要 <p>PURPOSE: A die bonder is provided to improve reliability by excluding the movement of a recognition camera to photograph an adhesive coating process. CONSTITUTION: A lead frame(34) moves in an X direction. A syringe(36) is installed on the upper side of the lead frame. An adhesive(37) is sealed in the syringe. A recognition camera(33) measures the location of the lead frame and an amount of coated adhesives. A lamp(38) is installed on the lower side of a recognition camera.</p>
申请公布号 KR20130009537(A) 申请公布日期 2013.01.23
申请号 KR20110089397 申请日期 2011.09.05
申请人 HITACHI HIGH-TECH INSTRUMENT CO., LTD. 发明人 MAKITA YOSHIAKI;FUKASAWA SHINGO
分类号 H01L21/52 主分类号 H01L21/52
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