| 摘要 |
<p>PURPOSE: A light emitting device and a light emitting device package including the same are provided to improve light extraction efficiency by arranging a micro lens array with a fill-factor on the surface of the light emitting structure. CONSTITUTION: A junction layer(150), a reflection layer(140) and an ohmic layer(130) are successively formed on a support substrate(160). A light emitting structure(120) is formed on the ohmic layer. The light emitting structure includes a first conductive semiconductor layer(122), an active layer(124), and a second conductive semiconductor layer(126). A micro lens array(170) is formed on the second conductive semiconductor layer. A first electrode(190) is formed on the micro lens array.</p> |
