发明名称 HIGH PERFORMANCE, SMALL FORM FACTOR CONNECTOR WITH COMMON MODE IMPEDANCE CONTROL
摘要 Techniques for improving electrical performance of a connector. The techniques are compatible with the form factor of a standardized connector, such as an SFP connector or stacked SFP. The resulting connector has reduced insertion loss for high speed signals. Such techniques, which can be used separately or together, include shaping of conductive elements within the connector while still retaining the same mating contact arrangement. Changes may be made at the contact tail portions or in the intermediate portions where engagement to a connector housing occurs. The techniques also include the incorporation of lossy bridging members between conductive elements designated to be ground conductors. For connectors according to the stacked SFP configuration, multiple bridging members may be incorporated at multiple locations within the connector.
申请公布号 US2013017733(A1) 申请公布日期 2013.01.17
申请号 US201013509452 申请日期 2010.11.12
申请人 AMPHENOL CORPORATION;KIRK BRIAN;KASTURI VIJAY 发明人 KIRK BRIAN;KASTURI VIJAY
分类号 H01R24/60 主分类号 H01R24/60
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