| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldering apparatus capable of suppressing insufficient wetting caused by a drop in temperature of a molten solder. <P>SOLUTION: The soldering apparatus includes a solder storage tank 2 in which a molten solder is stored, a nozzle 20 which communicates with the solder storage tank 2 and performs soldering at a wanted portion of a substrate 30 above the solder storage tank 2 by using the molten solder fed from the solder storage tank 2, and an outer peripheral wall 11 which covers the periphery of the nozzle 20. Between the nozzle 20 and the outer peripheral wall 11, there is a passage communicating with the solder storage tank 2, in which the molten solder flows parallel to the nozzle 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
