发明名称 PARALLEL LIFTING MECHANISM AND SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a technique capable of maintaining parallelism of one clamper to another clamper. <P>SOLUTION: In a parallel lifting mechanism 40 allowing a lower clamper 28 to move up and down toward an upper clamper 27, a leveling unit 29 is inserted by contacting with an opposite internal wall surface of a slide hole 26a. The leveling unit 29 includes a mounting block 52 for mounting the lower clamper, and a spring 51 disposed between the mounting block 52 and an opposite internal wall surface of the slide hole 26a. The leveling unit 29 slides inside the slide hole 26a while continuously positioning the mounting block 52 by pressing it to the internal wall surface of the slide hole 26a by the spring 51, to guide the vertical movement of the lower clamper 28 disposed on the mounting block 52. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013012541(A) 申请公布日期 2013.01.17
申请号 JP20110143367 申请日期 2011.06.28
申请人 APIC YAMADA CORP 发明人 TAKAHASHI YUICHI;NAKAJIMA KENJI;UEHARA KATSUHIRO;WAKUI MASAAKI
分类号 H05K13/04;B23K1/00;B23K3/00;B23K101/40;B23K101/42;H01L21/02;H01L21/56;H01L21/603 主分类号 H05K13/04
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