COOLING STRUCTURE FOR SEMICONDUCTOR ELEMENT

摘要

This cooling structure for a semiconductor element is provided with: a side wall (22), which is provided on the downstream side of a cooling air flow in a cooling air passage (31); a plurality of cooling fins (43) that form cooling air branch passages (41); and a plurality of cooling fins (53) that form cooling air branch passages (51). The cooling fins (43, 53) have end parts (43p, 53p) on tip parts that extend toward the cooling air passage (31). The slopes of a virtual line (61) obtained by joining the end parts (43p) between the plurality of cooling fins (43) and a virtual line (71) obtained by joining the end parts (53p) between the plurality of cooling fins (53) in the direction of the flow of the cooling air in the cooling air passage (31) are greater at the upstream side than the downstream side of the cooling air flow in the cooling air passage (31).