TEST SOCKET FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A test socket for a semiconductor package is provided to stably connect an upper contact tip to a package terminal. CONSTITUTION: A cover member(50) has a receiving part(51). The upper contact terminal of a contact electrically touches a terminal of a semiconductor package. The lower contact terminal of the contact is electrically connected to a test board. An adaptor(40) has a mounting surface(41). Multiple slots are formed in the mounting surface(42). As the cover member perpendicularly moves, a slider(20) opens and closes the upper contact tip of the contact.