| 发明名称 | Semiconductor package | ||
| 摘要 | A semiconductor package includes a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on the first semiconductor chip to expose at least a portion of the first semiconductor chip, and a stress-relieving structure provided at an edge of the first semiconductor chip and configured to relieve stress applied between the first semiconductor chip and the second semiconductor chip. | ||
| 申请公布号 | US9397052(B2) | 申请公布日期 | 2016.07.19 |
| 申请号 | US201414291698 | 申请日期 | 2014.05.30 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Park Soojae;Chun Hyunsuk |
| 分类号 | H01L23/49;H01L23/52;H01L29/40;H01L23/00;H01L25/065;H01L23/16;H01L23/31;H01L25/00 | 主分类号 | H01L23/49 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A semiconductor package comprising: a package substrate; a first semiconductor chip mounted on the package substrate; a second semiconductor chip mounted on the first semiconductor chip to expose at least a portion of the first semiconductor chip; a stress-relieving structure provided at an edge of the first semiconductor chip and configured to relieve stress applied between the first semiconductor chip and the second semiconductor chip; connection patterns provided between the first semiconductor chip and the second semiconductor chip and connecting the first semiconductor chip and the second semiconductor chip electrically; and an under-fill layer provided between the first semiconductor chip and the second semiconductor chip and covering the connection patterns. | ||
| 地址 | Suwon-si KR | ||