POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A power module package and a manufacturing method thereof are provided to improve heat radiation effects through a base substrate and a cooling channel by forming the cooling channel on the base substrate and integrating a heat sink with a power module. CONSTITUTION: A base substrate(110) is made of metal materials. A cooling channel(200) is formed in the center of the base substrate in a thickness direction. An anode oxidation layer(120) is formed on the outer side of the base substrate. A metal layer(130) includes a connection pad and a circuit formed on a first surface of the base substrate. A semiconductor device(140) is mounted on the metal layer.